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ST33TPHF2XSPI Datenblatt(PDF) 19 Page - STMicroelectronics |
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ST33TPHF2XSPI Datenblatt(HTML) 19 Page - STMicroelectronics |
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19 / 35 page ![]() 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 VFQFPN32 package information VFQFPN32 is a 32-lead, 5 × 5 mm, 0.5 mm pitch, very thin fine pitch quad flat pack no-lead package. Figure 13. VFQFPN32 - outline Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 Bottom view 1. Drawing is not to scale. ST33TPHF2XSPI Package information DS14186 - Rev 1 page 19/35 |
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