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ST33TPHF2XSPI Datenblatt(PDF) 21 Page - STMicroelectronics

Teilenummer ST33TPHF2XSPI
Bauteilbeschribung  STSAFE-TPM ST33TPHF2XSPI: TPM 2.0 device with an SPI interface
PDF  35 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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ST33TPHF2XSPI Datenblatt(HTML) 21 Page - STMicroelectronics

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6.2
Thermal characteristics of packages
The table below provides the thermal characteristics of the VFQFPN32 package.
Table 13. Thermal characteristics
Parameter
Symbol
Value
Recommended operating temperature range
Ambient temperature
TA
−40 to 105 °C
Case temperature
TC
-
Junction temperature
TJ
−43 to 108 °C
Absolute maximum junction temperature
-
125 °C
Maximum power dissipation
-
63 mW
Theta-JA, -JB and -JC
Junction to ambient thermal resistance
θJA(1)
35.8 at 0 lfpm (2)
Junction to case thermal resistance
θJC
1.48 at 0 lfpm(2)
Junction to board thermal resistance
θJB
13.9 at 0 lfpm(2)
1. According to JESD51-2 (still air condition).
2. Linear feet per minute.
ST33TPHF2XSPI
Thermal characteristics of packages
DS14186 - Rev 1
page 21/35



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