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BSP89 Datenblatt(PDF) 2 Page - NXP Semiconductors

Teilenummer BSP89
Bauteilbeschribung  N-channel enhancement mode vertical D-MOS transistor
PDF  8 Pages
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Hersteller  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BSP89 Datenblatt(HTML) 2 Page - NXP Semiconductors

  BSP89 Datasheet HTML 1Page - NXP Semiconductors BSP89 Datasheet HTML 2Page - NXP Semiconductors BSP89 Datasheet HTML 3Page - NXP Semiconductors BSP89 Datasheet HTML 4Page - NXP Semiconductors BSP89 Datasheet HTML 5Page - NXP Semiconductors BSP89 Datasheet HTML 6Page - NXP Semiconductors BSP89 Datasheet HTML 7Page - NXP Semiconductors BSP89 Datasheet HTML 8Page - NXP Semiconductors  
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April 1995
2
Philips Semiconductors
Product specification
N-channel enhancement mode vertical
D-MOS transistor
BSP89
FEATURES
• Direct interface to C-MOS, TTL,
etc.
• High-speed switching
• No secondary breakdown.
DESCRIPTION
N-channel enhancement mode
vertical D-MOS transistor in a
SOT223 envelope, intended for use
as a surface-mounted device in line
current interrupters in telephone sets
and for application in relay, high
speed and line transformer drivers.
PINNING - SOT223
PIN
DESCRIPTION
Code: BSP89
1
gate
2
drain
3
source
4
drain
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MAX.
UNIT
VDS
drain-source voltage
240
V
ID
DC drain current
350
mA
RDS(on)
drain-source on-resistance
6
VGS(th)
gate-source threshold voltage
2
V
Fig.1 Simplified outline (SOT223) and symbol.
handbook, halfpage
MAM109
4
12
3
Top view
s
d
g
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
THERMAL RESISTANCE
Note
1. Transistor mounted on an epoxy printed circuit board, 40 x 40 x 1.5 mm, mounting pad for the drain tab minimum
6cm2.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
240
V
±V
GSO
gate-source voltage
open drain
20
V
ID
DC drain current
350
mA
IDM
peak drain current
1.4
A
Ptot
total power dissipation
up to Tamb = 25 °C (note 1)
1.5
W
Tstg
storage temperature range
−65
150
°C
Tj
junction temperature
150
°C
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth j-a
from junction to ambient (note 1)
83.3 K/W



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