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BST76 Datenblatt(PDF) 3 Page - NXP Semiconductors |
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BST76 Datenblatt(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Jun 20 3 Philips Semiconductors Product specification N-channel enhancement mode vertical D-MOS transistor BST76A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS Note to the Limiting values and Thermal characteristics 1. Device mounted on a printed-circuit board, maximum lead length 4 mm; mounting pad for drain lead minimum 10 mm × 10 mm. CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage (DC) − 180 V VDS(SM) drain-source voltage non-repetitive peak; tp ≤ 2mS − 200 V VGSO gate-source voltage (DC) open drain −±20 V ID drain current (DC) − 300 mA IDM peak drain current − 800 mA Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 1W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient note 1 125 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID = 100 µA 180 −− V VGSth gate-source threshold voltage VDS =VGS; ID = 100 µA 0.7 − 2.4 V IDSS drain-source leakage current VDS = 120 V; VGS =0 −− 10 µA IGSS gate leakage current VDS = 0; VGS = ±20 V −−±100 nA RDSon drain-source on-state resistance VGS =3V; ID =15mA − 710 Ω VGS = 10 V; ID = 300 mA − 6 −Ω yfs forward transfer admittance ID = 300 mA; VDS =15V − 250 − mS Ciss input capacitance VDS =10V; VGS = 0; f = 1 MHz − 50 65 pF Coss output capacitance VDS =10V; VGS = 0; f = 1 MHz − 20 30 pF Crss reverse transfer capacitance VDS =10V; VGS = 0; f = 1 MHz − 610 pF Switching times (see Figs 2 and 3) ton turn-on time VGS = 0 to 10 V; VDS =50V; ID = 300 mA −− 10 ns toff turn-off time VGS =10to0V; VDS =50V; ID = 300 mA −− 15 ns |
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