AM29LV128ML113REF datasheet(66/66 Pages) AMD

66 / 66 page

Am29LV128MH/L

25270C7 January 31, 2007

D A TA

SH EE T

Revision C+3 (February 27, 2004)

Global

Changed Datasheet to Advanced Information.

Table 1, Device Bus Operations

Modified ACC column to replace instances of X to L/H.

Customer Lockable: Secured Silicon Sector NOT

Programmed or Protected at the Factory

Removed second paragraph.

Enter Secured Silicon Sector/Exit Secured Silicon

Sector Command Sequence

Added (write buffer) to last sentence of first paragraph.

Write Buffer Programming

Removed last paragraph.

Table 10 & Table 11, Command Definitions

Replaced the Addr information for both Program/Erase

Suspend and Program/Erase Resume from BA to

XXX.

Erase Suspend/Erase Resume Commands

Added note on flash device performance during

suspend/erase mode.

AC Characteristics - Erase and Program

Operations

Added t

POLL information.

Added notation referencing superceding documenta-

tion.

Revision C+4 (October 26, 2004)

Added Pb free options to the ordering information and

valid combinations table.

Revision C+5 (January 11, 2005)

Changed notation referencing superceding documentation.

Revision C+6 (October 28, 2005)

This product has been retired and is not recom-

mended for designs. For new and current designs,

S29GL256N supersedes Am29LV128MH/L and is the

factory-recommended migration path. Please refer to

the S29GL256N datasheet for specifications and or-

dering information. Availability of this document is re-

tained for reference and historical purposes only.

Revision C7 (January 31, 2007)

Global

Removed Preliminary designation from document.

Changed SecSi Sector to Secured Silicon Sector.

Erase and Program Operations table

Changed t

BUSY to a maximum specification.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion LLC will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

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