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AM29LV128ML123REF Datenblatt(PDF) 60 Page - Advanced Micro Devices |
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AM29LV128ML123REF Datenblatt(HTML) 60 Page - Advanced Micro Devices |
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60 / 66 page ![]() 60 Am29LV128MH/L 25270C7 January 31, 2007 D A TA SH EE T ERASE AND PROGRAMMING PERFORMANCE Notes: 1. Typical program and erase times assume the following conditions: 25 °C, 3.0 V V CC. Programming specifications assume that all bits are programmed to 00h. 2. Maximum values are measured at VCC = 3.0, worst case temperature. Maximum values are valid up to and including 100,000 program/erase cycles. 3. Word programming specification is based upon a single word programming operation not utilizing the write buffer. 4. For 1-16 words or 1-32 bytes programmed in a single write buffer programming operation. 5. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation. 6. The typical chip programming time is considerably less than the maximum chip programming time listed, since most words program faster than the maximum program times listed. 7. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure. 8. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 11 for further information on command definitions. 9. The device has a minimum erase and program cycle endurance of 100,000 cycles. Parameter Typ (Note 1) Max (Note 2) Unit Comments Sector Erase Time 0.5 3.5 sec Excludes 00h programming prior to erasure (Note 6) Chip Erase Time 128 256 sec Single Word Program Time (Note 3)60 600 µs Excludes system level overhead (Note 8) Accelerated Single Word Program Time (Note 3) 54 540 µs Total Write Buffer Program Time (Note 4) 240 1200 µs Effective Write Buffer Program Time (Note 5) Per Byte 7.5 38 µs Per Word 15 75 µs Total Accelerated Write Buffer Program Time (Note 4) 200 1040 µs Effective Accelerated Write Buffer Program Time (Note 5) Per Byte 6.25 33 µs Per Word 12.5 65 µs Chip Program Time 126 292 sec |
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