PTN3700 datasheet(3/41 Pages) PHILIPS

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PTN3700_1

Product data sheet

Rev. 01 — 14 August 2007

3 of 41

NXP Semiconductors

PTN3700

1.8 V simple mobile interface link bridge IC

Ordering information

[1]

0.5 mm ball pitch; 1.0 mm maximum package height.

4.1 Ordering options

Functional diagram

Table 1.

Ordering information

Type number

Solder process

Package

Name

Description

Version

PTN3700EV/G

Pb-free (SnAgCu

solder ball compound)

VFBGA56 plastic very thin ﬁne-pitch ball grid array package;

56 balls; body 4

× 4.5 × 0.65 mm[1]

SOT991-1

Table 2.

Ordering options

Type number

Topside mark

Temperature range

PTN3700EV/G

3700

−40 °C to +85 °C

Fig 1.

Functional diagram of PTN3700 in Transmitter mode

PTN3700

D0+

SERIALIZER

−

D1+

−

D2+

−

VDD

VDDA

PROTOCOL MAPPING,

PARITY ENCODING,

SYNC WORD ENCODING

INPUT

R[7:0]

G[7:0]

B[7:0]

A[1:0]

÷ 2

CLK+

CLK

−

PLL

PCLK

× PCLK

FSS

CONFIGURATION

AND

POWER MANAGEMENT

002aab363

LS[1:0]

PSEL[1:0]

XSD

FSS

TX/RX = HIGH

GND

GNDA

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