Figure 1. AMMC-5024 Schematic.

GND

Drain Bias

(Vdd)

Nine Identical

Vdd AUX

Second Gate

First Gate

Bias (Vg1)

RF_Input

DET_OUT

RF_Output

DET_BIAS

DET_REF

Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)

Thechipis100µmthickandshouldbehandledwith

care.

ThisMMIChasexposedairbridgesonthetopsurface.

Handleatedgesorwithacustomcollet(donotpickup

diewithvacuumondiecenter.)

ThisMMICisalsostaticsensitiveandESDhandlingprecau-

tionsshouldbetaken.

Formoredetailedinformation,seeAvagoApplication

Note54“GaAsMMICESD,DieAttachandBondingGuide-

lines.”

Notes:

1. Ablebond84-1LM1silverepoxyisrecommended.

2. Buckbee-MearsCorporation,St.Paul,MN,800-262-

3824

1050

960

RF INPUT

235

0

RF Output

90

733

90

2350

0 165

415550

830

Vdd_AUX

DET_Bias

Vdd

2260

GND

1270

DET_Output

DET_Reference

Vg2

485

2250

2080

GND