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STAV27240AY2 Datenblatt(PDF) 2 Page - Innogration Technologies, Inc. |
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STAV27240AY2 Datenblatt(HTML) 2 Page - Innogration Technologies, Inc. |
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2 / 6 page ![]() Innogration (Suzhou) Co., Ltd . 2 / 6 Document Number: STAV27240AY2 Preliminary Datasheet V1.0 Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS +200 Vdc Gate--Source Voltage VGS -8 to +0.5 Vdc Operating Voltage VDD 55 Vdc Maximum gate current Igs 30 mA Storage Temperature Range Tstg -65 to +150 C Case Operating Temperature TC +150 C Operating Junction Temperature TJ +225 C Table 2. Thermal Characteristics Characteristic Symbol Value Unit Thermal Resistance, Junction to Case by FEA TC= 85C, at Pd=60W RJC 1.4 C /W Table 3. Electrical Characteristics (TA = 25℃ unless otherwise noted) DC Characteristics (Each path, measured on wafer prior to packaging) Characteristic Conditions Symbol Min Typ Max Unit Drain-Source Breakdown Voltage VGS=-8V; IDS=30mA VDSS 200 V Gate Threshold Voltage VDS =10V, ID = 30mA VGS(th) -4 -2 V Gate Quiescent Voltage VDS =50V, IDS=200mA, Measured in Functional Test VGS(Q) -3.23 V Ruggedness Characteristics Characteristic Conditions Symbol Min Typ Max Unit Load mismatch capability 2.6GHz, Pout=240W pulse CW for each path All phase, No device damages VSWR 10:1 Figure 2: Median Lifetime vs. Channel Temperature |
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