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LP55281TL/NOPB Datenblatt(PDF) 2 Page - Texas Instruments

Teilenummer LP55281TL/NOPB
Bauteilbeschribung  LP55281 12-Channel RGB/White-LED Drive With SPI, I2C Interface
PDF  42 Pages
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Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
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LP55281TL/NOPB Datenblatt(HTML) 2 Page - Texas Instruments

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LP55281
SNVS458D – JUNE 2007 – REVISED OCTOBER 2016
www.ti.com
Product Folder Links: LP55281
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 5
6.1
Absolute Maximum Ratings ...................................... 5
6.2
ESD Ratings.............................................................. 5
6.3
Recommended Operating Conditions ....................... 5
6.4
Thermal Information .................................................. 6
6.5
Electrical Characteristics........................................... 6
6.6
SPI Timing Requirements ......................................... 9
6.7
I2C Timing Requirements ....................................... 10
6.8
Boost Converter Typical Characteristics................. 11
6.9
RGB Driver Typical Characteristics ........................ 12
7
Detailed Description ............................................ 13
7.1
Overview ................................................................. 13
7.2
Functional Block Diagram ....................................... 14
7.3
Feature Description................................................. 15
7.4
Device Functional Modes........................................ 23
7.5
Programming........................................................... 25
7.6
Register Maps ......................................................... 30
8
Application and Implementation ........................ 31
8.1
Application Information............................................ 31
8.2
Typical Application ................................................. 31
8.3
Initialization Set Up Example .................................. 34
9
Power Supply Recommendations ...................... 34
10
Layout................................................................... 35
10.1
Layout Guidelines ................................................. 35
10.2
Layout Example .................................................... 36
11
Device and Documentation Support ................. 37
11.1
Device Support...................................................... 37
11.2
Related Documentation ....................................... 37
11.3
Receiving Notification of Documentation Updates 37
11.4
Community Resources.......................................... 37
11.5
Trademarks ........................................................... 37
11.6
Electrostatic Discharge Caution ............................ 37
11.7
Glossary ................................................................ 37
12
Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (March 2013) to Revision D
Page
Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information
tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply
Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable
Information sections; update title............................................................................................................................................ 1
Added NRST pin connection to MCU on Simplified Schematic ............................................................................................ 1
Changed RθJA for YPG package from "60°C/W" to "48.9°C/W"and for YZR package from "60°C/W" to "49.1°C/W"............ 6
Changes from Revision B (March 2013) to Revision C
Page
Changed layout of National Semiconductor data sheet to TI format...................................................................................... 1



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