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MUX508, MUX509

SBAS758C – JANUARY 2016 – REVISED SEPTEMBER 2016

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Product Folder Links: MUX508 MUX509

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Copyright © 2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 4

6

Pin Configuration and Functions ......................... 4

7

Specifications......................................................... 6

7.1

Absolute Maximum Ratings ...................................... 6

7.2

ESD Ratings.............................................................. 6

7.3

Recommended Operating Conditions ....................... 6

7.4

Thermal Information .................................................. 7

7.5

Electrical Characteristics: Dual Supply ..................... 7

7.6

Electrical Characteristics: Single Supply................... 9

7.7

Typical Characteristics ............................................ 11

8

Parameter Measurement Information ................ 15

8.1

Truth Tables ............................................................ 15

8.2

On-Resistance ........................................................ 16

8.3

Off-Leakage Current ............................................... 16

8.4

On-Leakage Current ............................................... 17

8.5

Transition Time ....................................................... 17

8.6

Break-Before-Make Delay....................................... 18

8.7

Turn-On and Turn-Off Time .................................... 19

8.8

Charge Injection ...................................................... 20

8.9

Off Isolation ............................................................. 21

8.10

Channel-to-Channel Crosstalk .............................. 21

8.11

Bandwidth ............................................................. 22

8.12

THD + Noise ......................................................... 22

9

Detailed Description ............................................ 23

9.1

Overview ................................................................. 23

9.2

Functional Block Diagram ....................................... 23

9.3

Feature Description................................................. 24

9.4

Device Functional Modes........................................ 26

10

Applications and Implementation...................... 27

10.1

Application Information.......................................... 27

10.2

Typical Application ............................................... 27

11

Power-Supply Recommendations ..................... 29

12

Layout................................................................... 30

12.1

Layout Guidelines ................................................. 30

12.2

Layout Example .................................................... 30

13

Device and Documentation Support ................. 31

13.1

Documentation Support ........................................ 31

13.2

Related Links ........................................................ 31

13.3

Receiving Notification of Documentation Updates 31

13.4

Community Resources.......................................... 31

13.5

Trademarks ........................................................... 31

13.6

Electrostatic Discharge Caution ............................ 31

13.7

Glossary ................................................................ 31

14

Mechanical, Packaging, and Orderable

Information ........................................................... 32

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (July 2016) to Revision C

Page

•

Added D (SOIC) package to document.................................................................................................................................. 1

•

Changed last Features bullet to include SOIC package ........................................................................................................ 1

•

Changed second sentence of Description section ................................................................................................................. 1

•

Added SOIC package to Device Information table ................................................................................................................ 1

•

Changed MUX509 description in Device Comparison Table ................................................................................................. 4

•

Added D package to Pin Configuration and Functions section .............................................................................................. 4

•

Added D package to Thermal Information table .................................................................................................................... 7

•

Changed Analog Switch, ID parameter in Electrical Characteristics: Dual Supply table: split parameter into ID(OFF) and

ID(ON) parameters, changed symbols, parameter names, and test conditions ........................................................................ 7

•

Changed On-resistance drift parameter in Electrical Characteristics: Single Supply table: changed VS value in test

conditions................................................................................................................................................................................ 9

•

Changed Analog Switch, ID parameter in Electrical Characteristics: Single Supply table: split parameter into ID(OFF)

and ID(ON) parameters, changed symbols, parameter names, and ID(ON) test conditions........................................................ 9

•

Changed Figure 26: changed switch symbol to a closed switch symbol ............................................................................. 16

•

Changed Figure 32: added 0 V line, flipped VS supply symbol............................................................................................ 20

•

Changed description of MUX509 in Overview section ........................................................................................................ 23

•

Changed Figure 42: changed OPA140 amplifier and charge kickback filter box ................................................................. 27

•

Added D package description to Layout Guidelines section ................................................................................................ 30