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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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DAC5672MPFBREP Datenblatt(PDF) 4 Page - Texas Instruments |
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DAC5672MPFBREP Datenblatt(HTML) 4 Page - Texas Instruments |
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4 / 30 page  www.ti.com PFB PACKAGE THERMAL CHARACTERISTICS 0.1 1 10 100 1000 100 110 120 130 140 150 160 Electromigration Fail Mode Wirebond Voiding Fail Mode Continuous TJ − 5C DAC5672-EP SGLS339A – JUNE 2006 – REVISED OCTOBER 2006 PARAMETER POWERPAD CONNECTED TO PCB THERMAL PLANE Thermal resistance, junction to ambient 63.7 °C/W Thermal resistance, junction to case 19.6 °C/W Figure 1. DAC5672MPFB Operating Life Derating Chart 4 Submit Documentation Feedback |
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