www.ti.com

EXAMPLE STENCIL DESIGN

8X (1.4)

8X (0.45)

6X (0.65)

(4.4)

(R0.05) TYP

VSSOP - 1.1 mm max height

DGK0008A

SMALL OUTLINE PACKAGE

4214862/A 04/2023

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

SCALE: 15X

SYMM

SYMM

1

4

5

8