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SGLS286C − JUNE 2005 – REVISED SEPTEMBER 2008

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4

Long-term high−temperature storage and/or extended use at maximum recommended operating conditions may

result in a reduction of overall device life. See Figure 1 for additional information on thermal derating.

Electromigration failure mode applies to powered part; Kirkendall voiding failure mode is a function of temperature

only.

0.0000001

0.00001

0.0001

0.000001

125

°C (47 kHours, 55.8 Years)

105

°C (87 kHours, >10 Years)

125

°C (32 kHours, 3.8 Years)

Estimated Device life

ElectroMigration Fail Mode

150

°C

(21 kHours, 2.4 Years)

105

°C (8 MHours, >100 Years)

150

°C (10.5 kHours, 1.2 Years)

1/TJ − Constant Device Junction Temperature

Estimated Device Life

Wire Bond Kirkendall

Voiding Fail Mode

Figure 1. Time-to-Failure vs Junction Temperature