ADS5400IPZP datasheet(55/58 Pages) TI2

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EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

100X (1.5)

100X (0.3)

(1.35)

TYP

(1.35) TYP

(15.4)

(

0.2) TYP

VIA

96X (0.5)

(6)

(

12) NOTE 8

PowerPAD TQFP - 1.2 mm max height

PZP0100K

PLASTIC QUAD FLATPACK

4218999/A 12/2018

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

8. Size of metal pad may vary due to creepage requirement.

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:5X

SYMM

100

SOLDER MASK

DEFINED PAD

SEE DETAILS

METAL COVERED

BY SOLDER MASK

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

ADS5400IPZP Datenblatt(PDF) 55 Page - Texas Instruments

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