EXAMPLE BOARD LAYOUT

6X (

0.225)

(0.5) TYP

(0.5) TYP

(

)

METAL

0.225

0.05 MAX

SOLDER MASK

OPENING

METAL

UNDER

MASK

(

)

SOLDER MASK

OPENING

0.225

0.05 MIN

4219524/A 06/2014

DSBGA - 0.5 mm max height

YZP0006

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).

4.Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:40X

1

2

A

B

C

SOLDER MASK

NON-SOLDER MASK

DEFINED

(PREFERRED)

NOT TO SCALE

SOLDER MASK DETAILS

DEFINED

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CD3268A, CD3269A

SCHS463 – MAY 2025

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