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STPS1L30AFN Datenblatt(PDF) 7 Page - STMicroelectronics |
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STPS1L30AFN Datenblatt(HTML) 7 Page - STMicroelectronics |
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7 / 15 page ![]() 2.1 SMA package information • Epoxy meets UL94, V0 • Cooling method : by conduction (C) Figure 13. SMA package outline E1 E D C L A1 A2 b Table 4. SMA package mechanical data Ref. Dimensions Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 STPS1L30 SMA package information DS1243 - Rev 8 page 7/15 |
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