DLP3944-Q1 datasheet(2/41 Pages) TI2

2 / 41 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Pin Configuration and Functions...................................3

5 Specifications.................................................................. 7

5.1 Absolute Maximum Ratings........................................ 7

5.2 Storage Conditions..................................................... 8

5.3 ESD Ratings............................................................... 8

5.4 Recommended Operating Conditions.........................9

5.5 Thermal Information..................................................10

5.6 Electrical Characteristics...........................................11

5.7 Switching Characteristics..........................................12

5.8 Timing Requirements................................................12

5.9 System Mounting Interface Loads............................ 17

5.10 Micromirror Array Physical Characteristics............. 18

5.11 Micromirror Array Optical Characteristics............... 19

5.12 Window Characteristics.......................................... 19

5.13 Chipset Component Usage Specification............... 20

6 Detailed Description......................................................21

6.1 Overview................................................................... 21

6.2 Functional Block Diagram......................................... 21

6.3 Feature Description...................................................22

6.4 Device Functional Modes..........................................22

6.5 Optical Interface and System Image Quality

Considerations............................................................ 22

6.6 Micromirror Array Temperature Calculation.............. 24

6.7 Micromirror Power Density Calculation.....................26

6.8 Window Aperture Illumination Overfill Calculation.... 27

6.9 Micromirror Landed-On/Landed-Off Duty Cycle....... 28

7 Application and Implementation.................................. 28

7.1 Application Information............................................. 28

7.2 Typical Application.................................................... 29

7.3 Temperature Sensing................................................31

8 Power Supply Recommendations................................33

8.1 DMD Power Supply Power-Up Procedure................ 34

8.2 DMD Power Supply Power-Down Procedure........... 34

8.3 DMD Power Supply Sequencing Requirements....... 35

9 Layout.............................................................................36

9.1 Layout Guidelines..................................................... 36

10 Device and Documentation Support..........................37

10.1 Third-Party Products Disclaimer............................. 37

10.2 Device Support....................................................... 37

10.3 Support Resources................................................. 37

10.4 Trademarks.............................................................38

10.5 Electrostatic Discharge Caution..............................38

10.6 Glossary..................................................................38

11 Revision History.......................................................... 38

12 Mechanical, Packaging, and Orderable

Information.................................................................... 39

DLP3944-Q1

SLVSKK1 – DECEMBER 2025

www.ti.com

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