ADUCM310 datasheet(18/28 Pages) AD

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Data Sheet

ADuCM310

Rev. A Page 17 of 27

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 8.

Parameter

Rating

DD to AGNDx

−0.3 V to +3.96 V

NEG to AGNDx

−5.5 V to +0.3 V

VDACV

DD to AGNDx

−0.3 V to +5.5 V

IOVDDx to DGNDx

−0.3 V to +3.96 V

Digital Input Voltage to DGNDx

−0.3 V to IOVDDx + 0.3 V

Digital Output Voltage to DGNDx

−0.3 V to IOVDDx + 0.3 V

Analog Inputs to AGNDx

−0.3 V to AV

DD + 0.3 V

Total Positive GPIO Pins Current

0 mA to 30 mA

Total Negative GPIO Pins Current

−30 mA to 0 mA

IDAC3 Pull-Down Voltage

NEG − 0.3 V

IDAC3 Pull-Down Current

−100 mA

Operating Temperature Range

−10°C to +85°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

ESD Rating, All Pins

Human Body Model (HBM)

1 kV

Field-Induced Charged Device

Model (FICDM)

1.25 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 9. Thermal Resistance

Package Type

Unit

112-Ball CSP_BGA

44.5

°C/W

ESD CAUTION

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