STMPE811 datasheet(52/54 Pages) STMICROELECTRONICS

Teilenummer	STMPE811

Bauteilbeschribung	8-bit port expander with advanced touchscreen controller

PDF	54 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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Package mechanical data

STMPE811

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 12.

QFN16L (3 x 3 mm) package outline

Drawing not to scale.

Table 25.

QFN16 (3 x 3 mm) package mechanical data

Symbol

millimeters

inches

Min

Typ

Max

Min

Typ

Max

0.80

0.90

1.00

0.032

0.035

0.039

0.02

0.05

0.001

0.002

0.20

0.008

0.18

0.25

0.30

0.007

0.010

0.012

D3.00

0.118

1.55

1.70

1.80

0.061

0.067

0.071

E3.00

0.118

1.55

1.70

1.80

0.061

0.067

0.071

e0.50

0.020

K0.20

0.008

0.30

0.40

0.50

0.012

0.016

0.020

r0.09

0.006

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