PM6680 datasheet(46/49 Pages) STMICROELECTRONICS

Teilenummer	PM6680

Bauteilbeschribung	No Rsense dual step-down controller with adjustable voltages for notebook system power

PDF	49 Pages

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Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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46 / 49 page

Package mechanical data

PM6680

46/49

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 17.

VFQFPN 5x5x1.0 32L Pitch 0.50

Dim.

Databook (mm)

Min

Typ

Max

A0.8

0.9

0.02

0.05

0.2

0.18

0.25

0.3

D4.85

5.15

See exposed pad variations (2)

E4.85

5.15

See exposed pad variations (2)

e0.5

0.3

0.4

0.5

ddd

0.05

Table 18.

Exposed pad variations

(1)(2)D2

VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead. Very thin:

A = 1.00mm Max.

Dimensions D2 & E2 are not in accordance with JEDEC.

Min

Typ

Max

Min

Typ

Max

2.90

3.10

3.20

2.90

3.10

3.20

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