STLS2F02 datasheet(47/49 Pages) STMICROELECTRONICS

Teilenummer	STLS2F02

Bauteilbeschribung	Loongson 2F high performance 64-bit superscalar MIPS® microprocessor

PDF	49 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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47 / 49 page

STLS2F02

Package information

47/49

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 15.

HFCBGA452 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.150

0.1240

0.250

0.0098

1.300

0.0512

1.000

0.0394

0.450

0.500

0.550 0.0177 0.0197 0.0217

26.800 27.000 27.200 1.0551 1.0630 1.0709

25.000

0.9843

26.800 27.000 27.200 1.0551 1.0630 1.0709

25.000

0.9843

1.000

0.0394

1.000

0.0394

aaa

0.200

0.0079

ddd

0.200

0.0079

eee

0.250

0.0098

fff

0.100

0.0039

HFCBGA452 (27x27x2.9mm)

Heat Spreader Flip Chip Ball Grid Array

8061758 A

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