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chipan_reli-PRP3

chipan_reli_e-01

＊This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

1. PCB Design

Precautions

◆Land pattern design

Please do not arrange the surface and inside layer pattern near the antenna mounting area.

Technical

Consider-

ations

◆Land pattern design

Land pattern dimension examples and recommended antenna land pattern

Type

Dimensions

L

P

a

AF216M

2.5

1.5

3

AF816M

8

7

5

AF116M

11

10

3

Unit : mm

2. Soldering

Technical

Consider-

ations

◆Conditions of Reflow soldering (for reference)

・Pb Free Reflow Profile

・Reflow Profilev

3. Storage Conditions

Precautions

◆Storage conditions

1. The Products should not be used in the following environments :

・exposure to special gases such as (C12, NH3, SOx, NOx)

・exposure to volatile gas or inflammable gas

・exposure to a lot of dust

・exposure to water or condensation

・exposure to direct sanlight or freezing

2. The Products should be kept in the following conditions :

・Temperature : ー10～＋40℃

・Humidity

: 15～85％RH

3. The products should be used within 6 months after delivery. In case of storage over 6 months, solderability shall be checked before actual usage.

※ Components should be preheated to within

100 to 130℃ from soldering temperature.

※ Assured to be reflow soldering for 2 times.

Note : The above profiles are the maximum allow-

able soldering condition, therefore these

profiles are not always recommended.

■ Please contact our offices for further details of specifications.

All of the standard values listed here are subject to change without notice due to technical improvements.

Therefore, please check the specifications carefully before use.

AF216M/816M/116M

AH316M

AH104F

AH122F

AH104N

AH086M

AH083F