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335 Datenblatt(PDF) 6 Page - Intel Corporation

Teilenummer 335
Bauteilbeschribung  Celeron D Processor
PDF  82 Pages
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Hersteller  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

335 Datenblatt(HTML) 6 Page - Intel Corporation

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Datasheet
Tables
1-1
References.......................................................................................................... 13
2-1
Core Frequency to FSB Multiplier Configuration................................................. 16
2-2
Voltage Identification Definition........................................................................... 17
2-3
FSB Pin Groups .................................................................................................. 20
2-4
Signal Characteristics ......................................................................................... 21
2-5
Signal Reference Voltages.................................................................................. 21
2-6
BSEL[1:0] Frequency Table for BCLK[1:0] ......................................................... 22
2-7
Processor DC Absolute Maximum Ratings ......................................................... 22
2-8
Voltage and Current Specifications..................................................................... 23
2-9
VCC Static and Transient Tolerance.................................................................... 24
2-10
GTL+ Signal Group DC Specifications................................................................ 26
2-11
Asynchronous GTL+ Signal Group DC Specifications ........................................ 26
2-12
PWRGOOD and TAP Signal Group DC Specifications ...................................... 27
2-13
VCCVID DC Specifications ................................................................................. 27
2-14
VIDPWRGD DC Specifications ........................................................................... 27
2-15
BSEL [1:0] and VID[5:0] DC Specifications......................................................... 28
2-16
BOOTSELECT DC Specifications....................................................................... 28
2-17
VCC Overshoot Specifications ............................................................................. 28
2-18
GTL+ Bus Voltage Definitions ............................................................................. 30
3-1
Processor Loading Specifications ....................................................................... 34
3-2
Package Handling Guidelines ............................................................................. 35
3-3
Processor Materials ............................................................................................ 35
4-1
Alphabetical Pin Assignment............................................................................... 42
4-2
Numerical Pin Assignment .................................................................................. 48
4-3
Signal Description ............................................................................................... 54
5-1
Processor Thermal Specifications....................................................................... 64
5-2
Thermal Diode Parameters ................................................................................. 67
5-3
Thermal Diode Interface...................................................................................... 68
6-1
Power-On Configuration Option Pins .................................................................. 69
7-1
Fan Heatsink Power and Signal Specifications................................................... 76
7-2
Boxed Processor Fan Heatsink Set Points ......................................................... 79



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