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Thermal Specifications and Design Considerations

power consumption. The Thermal Monitor feature is intended to help protect the processor in the

unlikely event that an application exceeds the TDP recommendation for a sustained period of time.

For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal

Monitor feature must be enabled for the processor to remain within specification.

5.1.2

Thermal Metrology

The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature

specifications are meant to help ensure proper operation of the processor. Figure 5-1 illustrates

where Intel recommends TC thermal measurements should be made. For detailed guidelines on

temperature measurement methodology, refer to the applicable thermal design guide.

Table 5-1. Processor Thermal Specifications

Processor

Number

Core

Frequency

(GHz)

Thermal Design

Power (W)

Minimum TC

(°C)

Maximum TC

(°C)

Notes1,2

NOTES:

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The

TDP is not the maximum power that the processor can dissipate.

This table shows the maximum TDP for a given frequency range. Individual processors may

have a lower TDP.

350

3.20

—

345

3.06

—

340

2.93

—

335

2.80

—

330

2.66

—

325

2.53

—

320

2.40

—

Figure 5-1. Case Temperature (TC) Measurement Location

31 mm x 31 mm IHS [1.22 x 1.22 in]

35 mm x 35 mm substrate [1.378 in x 1.378 in]

Measure T

C at this point

(geometric center of IHS)

Measure from edge of processor IHS

15.5 mm [0.61 in]

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