MUN2212, MMUN2212L, MUN5212, DTC124EE, DTC124EM3, NSBC124EF3

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Table 2. THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

THERMAL CHARACTERISTICS (SC−59) (MUN2212)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25°C

(Note 1)

(Note 2)

230

338

1.8

2.7

mW

mW/°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

540

370

°C/W

Thermal Resistance,

(Note 1)

Junction to Lead

(Note 2)

264

287

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

THERMAL CHARACTERISTICS (SOT−23) (MUNN2212L)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25°C

(Note 1)

(Note 2)

246

400

2.0

3.2

mW

mW/°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

508

311

°C/W

Thermal Resistance,

(Note 1)

Junction to Lead

(Note 2)

174

208

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

THERMAL CHARACTERISTICS (SC−70/SOT−323) (MUN5212)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25°C

(Note 1)

(Note 2)

202

310

1.6

2.5

mW

mW/°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

618

403

°C/W

Thermal Resistance,

(Note 1)

Junction to Lead

(Note 2)

280

332

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

THERMAL CHARACTERISTICS (SC−75) (DTC124EE)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25°C

(Note 1)

(Note 2)

200

300

1.6

2.4

mW

mW/°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

600

400

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

THERMAL CHARACTERISTICS (SOT−723) (DTC124EM3)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25°C

(Note 1)

(Note 2)

260

600

2.0

4.8

mW

mW/°C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

480

205

°C/W

Junction and Storage Temperature Range

−55 to +150

°C

1. FR−4 @ Minimum Pad.

2. FR−4 @ 1.0 x 1.0 Inch Pad.