CXK582000TM datasheet(10/11 Pages) SONY

Teilenummer	CXK582000TM

Bauteilbeschribung	262144-word X 8-bit High Speed CMOS Static RAM

PDF	11 Pages

Scroll/Zoom	100%

Hersteller	SONY [Sony Corporation]

Direct Link	http://www.sony.co.jp

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10 / 11 page

– 10 –

CXK582000TM/YM/M

Package Outline

Unit: mm

SONY CODE

EIAJ CODE

JEDEC CODE

TSOP-32P-L01

TSOP032-P-0820-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

42 ALLOY

SOLDER PLATING

EPOXY / PHENOL RESIN

0° to 10°

32PIN TSOP (I) (PLASTIC)

8.0 ± 0.2

0.2 – 0.03

+ 0.08

0.5

NOTE :

∗NOT INCLUDE MOLD FINS.

116

0.127 –

0.02

+ 0.05

0.1 ± 0.1

1.07 – 0.1

+ 0.2

DETAIL A

0.1

0.08 M

CXK582000YM

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

42 ALLOY

TSOP-32P-L01R

TSOP032-P-0820-B

32PIN TSOP (PLASTIC)

0.08

0.5

0.2 – 0.03

+ 0.08

8.0 ± 0.2

1.07 – 0.1

+ 0.2

0.127 – 0.02

+ 0.05

0.1 ± 0.1

0° to 10°

0.1

DETAIL A

0.3g

NOTE > Dimension “

∗” does not include mold protrusion.

CXK582000TM

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