CXK5V8257BTM datasheet(8/9 Pages) SONY

Teilenummer	CXK5V8257BTM

Bauteilbeschribung	32768-word X 8-bit High Speed CMOS Static RAM

PDF	9 Pages

Scroll/Zoom	100%

Hersteller	SONY [Sony Corporation]

Direct Link	http://www.sony.co.jp

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CXK5V8257BTM/BYM/BM

Package Outline

Unit: mm

CXK5V8257BTM

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER / 42 ALLOY

28PIN TSOP (Plastic)

∗8.0 ± 0.1

0.55 ± 0.1

1.2 MAX

0° to 10°

0.2 – 0.05

+ 0.1

0.05 – 0.05

+ 0.1

0.127 – 0.02

+ 0.07

TSOP-28P-L01

TSOP028-P-0000-A

0.1

DETAIL A

0.2g

NOTE: Dimension “

∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER / 42 ALLOY

28PIN TSOP (Plastic)

∗8.0 ± 0.1

0.55 ± 0.1

1.2 MAX

0.2 – 0.05

+ 0.1

0.05 – 0.05

+ 0.1

0.127 – 0.02

+ 0.07

TSOP-28P-L01R

TSOP028-P-0000-B

0.1

0° to 10°

DETAIL A

0.2g

NOTE: Dimension “

∗” does not include mold protrusion.

CXK5V8257BYM

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