STPS3150

Characteristics

Doc ID 9474 Rev 5

5/10

Figure 17.

Thermal resistance junction to ambient versus copper surface under each lead

(epoxy printed board copper thickness = 35 µm)

Figure 13.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 14.

Forward voltage drop versus

forward current

C(pF)

10

100

1000

1

10

100

1000

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

V (V)

R

I

(A)

FM

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(typical values)

j

T =125°C

(maximum values)

j

Figure 15.

Thermal resistance junction to

ambient versus copper surface

under each lead

Figure 16.

Thermal resistance junction to

ambient versus copper surface

under each lead

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S (cm²)

Cu

SMB

epoxy printed board copper thickness = 35 µm

Rth(°C/W)

0

10

20

30

40

50

60

70

80

90

5

1015

2025

Rth(j-I)

Rth(j-a)

L

(mm)

leads

DO-201AD

epoxy printed board copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S

(cm²)

CU

SMB flat

R

(°C/W)

th(j-a)