DAC8143

–4–

REV. C

PIN CONNECTIONS

16-Lead Epoxy Plastic DIP

16-Lead SOIC

TOP VIEW

(Not to Scale)

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

DAC8143

AGND

CLR

DGND

SRO

SRI

ABSOLUTE MAXIMUM RATINGS

°C, unless otherwise noted.)

±25 V

Operating Temperature Range

FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

Package Type

JC

Units

16-Lead Plastic DIP

76

33

°C/W

16-Lead SOIC

92

27

°C/W

*

θ

θ

device in socket for P-DIP package;

θ

printed circuit board for SOIC package.

CAUTION

2. The digital control inputs are Zener-protected; however,

permanent damage may occur on unprotected units from

high energy electrostatic fields. Keep units in conductive

foam at all times until ready to use.

3. Use proper antistatic handling procedures.

4. Absolute Maximum Ratings apply to packaged devices.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device.

ORDERING GUIDE

Gain

Temperature

Package

Package

Model

Nonlinearity

Error

Range

Descriptions

Options

DAC8143FP

±1 LSB

±2 LSB

–40

°C to +85°C

16-Lead Plastic DIP

N-16

DAC8143FS

±1 LSB

±2 LSB

–40

°C to +85°C

16-Lead SOIC

R-16W

Die Size: 99

× 107 mil, 10,543 sq. mils.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE