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STLUX385ATR Datenblatt(PDF) 92 Page - STMicroelectronics |
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STLUX385ATR Datenblatt(HTML) 92 Page - STMicroelectronics |
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92 / 99 page ![]() Thermal characteristics STLUX385A 92/98 DocID024387 Rev 2 11 Thermal characteristics The STLUX385A functionality cannot be guaranteed when the device is operating under the maximum chip junction temperature (T Jmax ). T Jmax , in degrees Celsius, may be calculated using the following equation: Where: T Amax is the maximum ambient temperature in °C Θ JA is the package junction-to-ambient thermal resistance in °C/W P Dmax is the sum of P INTmax and P I/Omax (P Dmax = P INTmax + PI/O max ) P INTmax is the product of I DD and V DD , expressed in watts. This is the maximum chip internal power. P I/Omax represents the maximum power dissipation on output pins where: P I/Omax = Σ (V OL *I OL ) + Σ((V DD -V OH )*I OH ), taking into account the actual V OL /I OL and V OH /I OH of the I/Os at low and high level. Table 59. Package thermal characteristics Symbol Parameter Value Unit Θ JA Thermal resistance junction-to-ambient (1) 1. Thermal resistance are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment. 80 °C/W T Jm a x T Am a x PD max Θ JA × () + = |
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