LP55231 datasheet(4/53 Pages) TI

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LP55231

SNOSCR5 – MARCH 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Voltage on power pin VDD

-0.3 to +6.0

Voltage Range

Voltage on D1 to D9, C1

−, C1+,

−0.3V to VDD +0.3V

−, C2+, VOUT

with 6.0V max

Continuous Power Dissipation(3)

Internally Limited

Junction Temperature (TJ-MAX)

125

°C

Temperature

Storage Temperature Range

−65 to +150

Maximum Lead Temperature (Soldering)

See(4)

Human Body Model: D1 to D9

8(5)

Human Body Model: All Other Pins

2.5(5)

ESD Rating

Machine Model: All Pins

250(6)

Charge Device Model: All Pins

1000(7)

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(4)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1187 : Leadless Leadframe

Package (LLP).

(5)

Human Body Model, applicable standard JESD22-A114C

(6)

Machine Model, applicable standard JESD22- A115-A

(7)

Charge Device Model, applicable standard JESD22A-C101

RECOMMENDED OPERATING CONDITIONS

(1) (2)

Input Voltage Range

2.7 to 5.5

VDD

Voltage on Logic Pins (Input or Output Pins)

0 to VDD

IOUT

Recommended Charge Pump Load Current

0 to 100

Junction Temperature (TJ) Range

−30 to +125

°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance

°C/W

θJA

36.6

RTW0024A Package(1)

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

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