MPC8349EVVALDB datasheet(23/87 Pages) FREESCALE

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13

Freescale Semiconductor

Ethernet: Three-Speed Ethernet, MII Management

8.1.1

TSEC DC Electrical Characteristics

GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes

specified in Table 23 and Table 24. The RGMII and RTBI signals in Table 24 are based on a 2.5-V CMOS

interface voltage as defined by JEDEC EIA/JESD8-5.

8.2

GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications

The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.

8.2.1

GMII Timing Specifications

This section describes the GMII transmit and receive AC timing specifications.

Table 23. GMII/TBI and MII DC Electrical Characteristics

Parameter

Symbol

Conditions

Min

Max

Unit

Supply voltage 3.3 V

LVDD

—

2.97

3.63

Output high voltage

VOH

IOH = –4.0 mA

LVDD = Min

2.40

LVDD +0.3

Output low voltage

VOL

IOL = 4.0 mA

LVDD = Min

GND

0.50

Input high voltage

VIH

——

2.0

LVDD +0.3

Input low voltage

VIL

—

–0.3

0.90

Input high current

IIH

VIN

1 = LV

—40

μA

Input low current

IIL

VIN

1 = GND

–600

—

μA

Notes:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply.

Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics

Parameters

Symbol

Conditions

Min

Max

Unit

Supply voltage 2.5 V

LVDD

—

2.37

2.63

Output high voltage

VOH

IOH = –1.0 mA

LVDD = Min

2.00

LVDD +0.3

Output low voltage

VOL

IOL = 1.0 mA

LVDD = Min

GND – 0.3

0.40

Input high voltage

VIH

—LVDD = Min

1.7

LVDD +0.3

Input low voltage

VIL

—LVDD = Min

–0.3

0.70

Input high current

IIH

VIN

1 = LV

—10

μA

Input low current

IIL

VIN

1 = GND

–15

—

μA

Note:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

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