RM0319 datasheet(30/368 Pages) STMICROELECTRONICS

Teilenummer	RM0319

Bauteilbeschribung	SPEAr320S architecture and functionality

PDF	368 Pages

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Hersteller	STMICROELECTRONICS [STMicroelectronics]

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Multilayer interconnect matrix (BUSMATRIX)

RM0319

30/368

Doc ID 022640 Rev 3

Multilayer interconnect matrix (BUSMATRIX)

This chapter focuses on BUSMATRIX functionality and operation.

For technical details about the programmable registers related to the BUSMATRIX, refer to

the system configuration registers (MISC) in the following companion document:

●

RM0321: SPEAr320S address map and registers

4.1

Overview

The internal architecture is based on several shared subsystem logics interconnected

through a multilayer interconnection matrix, shown in Figure 3.

The BUSMATRIX has 7 master inputs: two DMA inputs, and one input each for the CPU,

Reconfigurable Array Subsystem (RAS) block, Ethernet controller, USB controllers and C3.

There are 10 slave outputs connected to almost all the system blocks: low speed

subsystem, application subsystem, basic subsystem, high speed subsystem, RAS and

MPMC DDR memory controller ports.

RM0319 Datenblatt(PDF) 30 Page - STMicroelectronics