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DMN3150L Datenblatt(PDF) 2 Page - Diodes Incorporated |
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DMN3150L Datenblatt(HTML) 2 Page - Diodes Incorporated |
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2 / 5 page ![]() DMN3150L Document number: DS31126 Rev. 9 - 2 2 of 5 www.diodes.com October 2013 © Diodes Incorporated DMN3150L Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain Source Voltage VDSS 30 V Gate-Source Voltage VGSS 12 V Drain Current (Note 5) TA = +25°C TA = +70°C ID 3.8 3.1 A Drain Current (Note 5) Pulsed IDM 15 A Body-Diode Continuous Current (Note 5) IS 2.0 A Thermal Characteristics Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 1.4 W Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5) RJA 90 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current IDSS 800 nA VDS = 28V, VGS = 0V Gate-Body Leakage IGSS 80 800 nA VGS = ±12V, VDS = 0V VGS = ±19V, VDS = 0V ON CHARACTERISTICS (Note 6) Gate Threshold Voltage VGS(th) 0.62 0.92 1.4 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS (ON) 39 52 90 54 72 115 mΩ VGS = 10V, ID = 3.8A VGS = 4.5V, ID = 3.6A VGS = 2.5V, ID = 3.1A Forward Transconductance |Yfs| 3 S VDS = 5V, ID = 3.1A Source-Drain Diode Forward Voltage VSD 1.16 V VGS = 0V, IS = 2.0A DYNAMIC CHARACTERISTICS (Note 7) Gate Resistance Rg - 4.17 - Ω VDS =0V, VGS = 0V, f = 1MHz Total Gate Charge (10V) Qg - 8.2 - nC VGS = 10 V, VDS = 10V, ID = 3.8 A Total Gate Charge (4.5V) Qg - 3.7 - nC VGS =4.5 V, VDS = 10V, ID = 3.8 A Gate-Source Charge Qgs - 0.7 - nC Gate-Drain Charge Qgd - 1.1 - nC Turn-On Delay Time tD(on) - 1.14 - ns VDD = 15V, VGEN = 10V, RGEN = 6Ω, RL = 3.9Ω Turn-On Rise Time tr - 3.49 - ns Turn-Off Delay Time tD(off) - 15.02 - ns Turn-Off Fall Time tf - 3.26 - ns Input Capacitance Ciss 305 pF VDS = 5V, VGS = 0V f = 1.0MHz Output Capacitance Coss 74 pF Reverse Transfer Capacitance Crss 48 pF Notes: 5. Device mounted on FR-4 PCB. t ≤5 sec. 6. Short duration pulse test used to minimize self-heating effect. 7. Guaranteed by design. Not subject to production testing. |
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