USB5534B datasheet(60/73 Pages) MICROCHIP

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USB5534B

DS00001681C-page 60

 2012 - 2015 Microchip Technology Inc.

6.5

Capacitance

Note 6-4

Capacitance TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V

6.5.1

PACKAGE THERMAL SPECIFICATIONS

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multi-

layer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are

based on the package body, die size, maximum power consumption, 70°C ambient temperature, and 125°C junction

temperature of the die.

Use the following formulas to calculate the junction temperature:

TJ = P x

JA + TA

TJ = P x

JT + TT

TJ = P x

JC + TC

TABLE 6-3:

PIN CAPACITANCE

Limits

Parameter

Symbol

MIN

TYP

MAX

Unit

Test Condition

Clock Input Capacitance

CXTAL

All pins except USB pins and the pins

under the test tied to AC ground

Input Capacitance

CIN

5pF

Output Capacitance

COUT

Symbol

USB5534B

(°C/W)

VELOCITY

(Meter/s)



23.0



0.1



1.4

Symbol

Description

Junction temperature

Power dissipated



Junction-to-ambient-temperature



Junction-to-top-of-package



Junction-to-bottom-of-case

Ambient temperature

Temperature of the bottom of the case

Temperature of the top of the case

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