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LP5560 Datenblatt(PDF) 2 Page - Texas Instruments |
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LP5560 Datenblatt(HTML) 2 Page - Texas Instruments |
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2 / 29 page ![]() 2 LP5560 SNVS873D – AUGUST 2012 – REVISED JUNE 2016 www.ti.com Product Folder Links: LP5560 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Single-Wire Interface Timing Requirements ............. 6 6.7 Typical Characteristics .............................................. 7 7 Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 9 7.4 Device Functional Modes........................................ 17 7.5 Programming .......................................................... 18 7.6 Registers ................................................................. 18 8 Application and Implementation ........................ 19 8.1 Application Information............................................ 19 8.2 Typical Application ................................................. 19 9 Power Supply Recommendations ...................... 22 10 Layout................................................................... 22 10.1 Layout Guidelines ................................................. 22 10.2 Layout Example .................................................... 22 11 Device and Documentation Support ................. 23 11.1 Documentation Support ........................................ 23 11.2 Receiving Notification of Documentation Updates 23 11.3 Community Resources.......................................... 23 11.4 Trademarks ........................................................... 23 11.5 Electrostatic Discharge Caution ............................ 23 11.6 Glossary ................................................................ 23 12 Mechanical, Packaging, and Orderable Information ........................................................... 23 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (May 2013) to Revision D Page • Added additional Applications, Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections................................................................................................................................................................ 1 • Changed RθJA value from "120°C/W" to "184.3°C/W"; added additional thermal values ....................................................... 5 Changes from Revision B (April 2013) to Revision C Page • Changed layout of National Data Sheet to TI format ........................................................................................................... 18 |
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