STM32F732ICK6 datasheet(7/122 Pages) STMICROELECTRONICS

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STM32F732xx STM32F733xx

List of figures

Figure 1.

Compatible board design for LQFP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 2.

Compatible board design for LQFP64 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 3.

Compatible board design for LQFP144 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 4.

Compatible board design for LQFP176 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 5.

STM32F732xx and STM32F733xx block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 6.

STM32F732xx and STM32F733xx AXI-AHB bus matrix architecture(1). . . . . . . . . . . . . . . 18

Figure 7.

VDDUSB connected to VDD power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 8.

VDDUSB connected to external power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 9.

Power supply supervisor interconnection with internal reset OFF . . . . . . . . . . . . . . . . . . . 25

Figure 10.

PDR_ON control with internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 11.

Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 12.

Startup in regulator OFF: slow VDD slope

- power-down reset risen after VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 13.

Startup in regulator OFF mode: fast VDD slope

- power-down reset risen before VCAP_1/VCAP_2 stabilization . . . . . . . . . . . . . . . . . . . . . . 29

Figure 14.

STM32F732xx LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 15.

STM32F732xx LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 16.

STM32F733xx WLCSP100 ballout (with OTG PHY HS) . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 17.

STM32F732xx LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 18.

STM32F733xx LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Figure 19.

STM32F733xx UFBGA144 ballout (with OTG PHY HS). . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Figure 20.

STM32F732xx LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Figure 21.

STM32F733xx LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Figure 22.

STM32F733xx UFBGA176 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Figure 23.

STM32F733xx UFBGA176 ballout (with OTG PHY HS). . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Figure 24.

Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Figure 25.

LQFP64 – 10 x 10 mm, low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . 102

Figure 26.

LQFP64 – 10 x 10 mm, low-profile quad flat package recommended footprint . . . . . . . . 103

Figure 27.

LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 104

Figure 28.

LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Figure 29.

LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 106

Figure 30.

LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 31.

LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 108

Figure 32.

LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Figure 33.

UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Figure 34.

UFBGA144 - 144-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Figure 35.

UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Figure 36.

UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Figure 37.

WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Figure 38.

WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale

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