Package information

HSP061-4F4

4/7

DocID022207 Rev 2

2

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9. Flip Chip dimensions

300 µm ±40

Ø 140 µm ±15

380 µm ±20

100 µm ±15

1200 µm ±50

Figure 10. Footprint recommendations

(dimensions in mm)

Figure 11. Marking

130 µm recommended

130 µm recommended

170 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

230 µm minimum

x

y

z

w

x

w

Dot,

xx = marking

yww = datecode

y = year,

ww = week

z = manufacturing

location