Data Sheet M11657EJBV0DS

26

Recommended Soldering Conditions

The following conditions must be met when soldering conditions of the

µPD431000A.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

Types of Surface Mount Device

µPD431000AGW-xxL

: 32-pin PLASTIC SOP (13.34 mm (525))

µPD431000AGW-xxLL

: 32-pin PLASTIC SOP (13.34 mm (525))

µPD431000AGW-Axx

: 32-pin PLASTIC SOP (13.34 mm (525))

µPD431000AGW-Bxx

: 32-pin PLASTIC SOP (13.34 mm (525))

µPD431000AGZ-xxL-KJH : 32-pin PLASTIC TSOP(I) (8x20) (Normal bent)

µPD431000AGZ-xxLL-KJH : 32-pin PLASTIC TSOP(I) (8x20) (Normal bent)

µPD431000AGZ-xxLL-KKH : 32-pin PLASTIC TSOP(I) (8x20) (Reverse bent)

µPD431000AGZ-Bxx-KJH : 32-pin PLASTIC TSOP(I) (8x20) (Normal bent)

µPD431000AGZ-Bxx-KKH : 32-pin PLASTIC TSOP(I) (8x20) (Reverse bent)

µPD431000AGU-Bxx-9JH : 32-pin PLASTIC TSOP(I) (8x13.4) (Normal bent)

µPD431000AGU-Bxx-9KH : 32-pin PLASTIC TSOP(I) (8x13.4) (Reverse bent)

Please consult with our sales offices.

Types of Through Hole Mount Device

µPD431000ACZ-xxL: 32-pin PLASTIC DIP (15.24 mm (600))

µPD431000ACZ-xxLL: 32-pin PLASTIC DIP (15.24 mm (600))

Soldering process

Soldering conditions

Wave soldering (Only to leads)

Solder temperature: 260

°C or below, Flow time: 10 seconds or below

Partial heating method

Pin temperature : 300

°C or below, Time: 3 seconds or below (Per one lead)

Caution Do not jet molten solder on the surface of package.