MCP6281/2/3/4/5

DS21811D-page 26

 2004 Microchip Technology Inc.

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

8

4

0

8

4

0

φ

Foot Angle

10

5

0

10

5

0

β

Mold Draft Angle Bottom

10

5

0

10

5

0

α

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

B1

Lead Width

0.20

0.15

0.09

.008

.006

.004

c

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

L

Foot Length

5.10

5.00

4.90

.201

.197

.193

D

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

E1

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

E

Overall Width

0.15

0.10

0.05

.006

.004

.002

A1

Standoff

§

0.95

0.90

0.85

.037

.035

.033

A2

Molded Package Thickness

1.10

.043

A

Overall Height

0.65

.026

p

Pitch

14

14

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

L

β

c

φ

2

1

D

n

B

p

E1

E

α

A2

A1

A

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-087

§ Significant Characteristic