| Datenblatt-Suchmaschine für elektronische Bauteile |
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AD5424 Datenblatt(PDF) 24 Page - Analog Devices |
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AD5424 Datenblatt(HTML) 24 Page - Analog Devices |
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24 / 24 page ![]() REV. 0 –24– AD5424/AD5433/AD5445 OUTLINE DIMENSIONS 20-Lead Lead Frame Chip Scale Package [LFCSP] (CP-20) Dimensions shown in millimeters 1 20 5 6 11 16 15 BOTTOM VIEW 10 2.25 2.10 SQ 1.95 0.75 0.55 0.35 0.30 0.23 0.18 0.50 BSC 12 MAX 0.20 REF 0.80 MAX 0.65 NOM 0.05 0.02 0.00 1.00 0.90 0.80 SEATING PLANE PIN 1 INDICATOR TOP VIEW 3.75 BSC SQ 4.0 BSC SQ COPLANARITY 0.08 0.60 MAX 0.60 MAX 0.25 MIN COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters 20 1 11 10 6.40 BSC 4.50 4.40 4.30 PIN 1 6.60 6.50 6.40 SEATING PLANE 0.15 0.05 0.30 0.19 0.65 BSC 1.20 MAX 0.20 0.09 0.75 0.60 0.45 8 0 COMPLIANT TO JEDEC STANDARDS MO-153AC COPLANARITY 0.10 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters 16 9 8 1 PIN 1 SEATING PLANE 8 0 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153AB |
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