ADHV4702-1BCPZ-R7 datasheet(21/21 Pages) AD

21 / 21 page

Data Sheet

ADHV4702-1

Rev. A | Page 21 of 21

OUTLINE DIMENSIONS

7.10

7.00 SQ

6.90

0.35

0.30

0.25

2.90

2.80 SQ

2.70

1.70

BSC

BOTTOM VIEW

SIDE VIEW

0.55

0.50

0.45

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

EXPOSED

PAD

PIN 1

INDICATOR

AREA

Figure 64. 12-Lead Lead Frame Chip Scale Package [LFCSP]

7 mm × 7 mm Body and 0.75 mm Package Height

(CP-12-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADHV4702-1BCPZ

−40°C to +85°C

12-Lead Lead Frame Chip Scale Package [LFCSP]

CP-12-8

ADHV4702-1BCPZ-R7

−40°C to +85°C

12-Lead Lead Frame Chip Scale Package [LFCSP]

CP-12-8

EVAL-ADHV4702-1CPZ

Evaluation Board

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D16047-0-3/19(A)

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