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CBM708 Datenblatt(PDF) 4 Page - COREBAI Microelectronics (Beijing) Co., Ltd.

Teilenummer CBM708
Bauteilbeschribung  OPERATION INSTRUCTION
PDF  18 Pages
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Hersteller  COREBAI [COREBAI Microelectronics (Beijing) Co., Ltd.]
Direct Link  http://www.corebai.com/en/
Logo COREBAI - COREBAI Microelectronics (Beijing) Co., Ltd.

CBM708 Datenblatt(HTML) 4 Page - COREBAI Microelectronics (Beijing) Co., Ltd.

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CBM705/CBM706/CBM707/CBM708
OPERATION INSTRUCTION
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
VCC
−0.3 V to +6 V
All Other Inputs
−0.3V to
VCC+0.3V
Input Current
VCC
20mA
GND
20mA
Digital Output Current
20mA
Power Dissipation, N-8 PDIP
727mW
θJA Thermal Impedance
135℃
Power Dissipation, R-8 SOIC
470mW
θJA Thermal Impedance
110℃/W
Power Dissipation, RM-8 MSOP 900mW
θJA Thermal Impedance
206℃/W
Operating Temperature Range
Industrial (Version A)
-40℃ to +85℃
Lead Temperature (Soldering,
10 sec)
300℃
Vapor Phase (60 sec)
215℃
Infrared (15 sec)
220℃
Storage Temperature Range
-65℃ to +150℃
ESD Rating
>4.5kV
Stresses at or above those listed under
Absolute Maximum Ratings may cause
permanent damage to the product. This is a
stress rating only; functional operation of the
product at these or any other conditions
above those indicated in the operational
section of this specification is not implied.
Operation
beyond
the
maximum
operating conditions for extended periods
may affect product reliability.



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