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VR13 Datenblatt(PDF) 9 Page - Infineon Technologies AG

Teilenummer VR13
Bauteilbeschribung  VR13 and VR12.5 Multi-rail / Multiphase Digital Controllers
PDF  20 Pages
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Hersteller  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

VR13 Datenblatt(HTML) 9 Page - Infineon Technologies AG

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PXE1110C
PDS-PXE1-PXM1-C-001A
9
Pin #
Name
I/O
Type
Description
35
ATSEN
I
Analog
Loop_A external temperature sense input. If the digital controllers
’ internal
temperature sensor is selected and/or the external temperature reporting
is not required, the ATSEN pin may be left open (floating).
36
XADDR1
I
Analog
Used in conjunction with XADDR2, the I2C address of the controller is set
by tying an external resistor between this pin and GND.
37
VINSEN
I
Analog
VIN (+12V) voltage sense input. The VINSEN pin may be connected to
the +12V supply through a resistor divider, or to the PI sense network and
is used to guarantee a valid input voltage before starting up (input under-
voltage lockout). Refer to the Power Input Sense section herein for details.
If unused, this pin may be grounded.
38
IINSEN
I
Analog
Current sense input used for PWR_IN calculation. An external amplifier or
the PI sense network may be used to translate current information from a
precision sense resistor to an input signal for the controller. Refer to the
Power Input Sense section herein for details. If unused, this pin may be
grounded.
39
VDD
S
supply
3.3V power supply input to the digital controller. This pin should be
connected to the system +3.3V supply and decoupled using high quality
1.0μF + 0.1μF ceramic capacitors.
40
VD12
S
Internal
Supply
Do not apply voltage to or ground this pin. Internally generated 1.2V
voltage reference used to power digital core logic. The pin is provided for
attaching external decoupling capacitors only. Decouple using high quality
1.0μF + 0.1μF ceramic capacitors. This pin is not intended to be used to
drive external components as +1.2V reference.
Die Paddle
S
Ground
Exposed Ground pad beneath the device must be soldered to the PCB
ground for proper operation.



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