| Datenblatt-Suchmaschine für elektronische Bauteile |
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ST33TPHF2ESPI Datenblatt(PDF) 9 Page - STMicroelectronics |
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ST33TPHF2ESPI Datenblatt(HTML) 9 Page - STMicroelectronics |
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9 / 26 page ![]() 5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 5.1 TSSOP28 package information TSSOP28 is a 28-pin, 9.7 × 6.4 mm, 4.4 mm body width, 0.65 mm pitch, thin shrink small outline package. Unless otherwise specified, general tolerance is ± 0.1 mm. Figure 5. TSSOP28 - outline c L k A1 aaa A2 A e b 1 28 14 15 D E E1 L1 1. Drawing is not to scale. Table 2. TSSOP28 - mechanical data Symbol millimeters inches (1) Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 D 9.600 9.700 9.800 0.3780 0.3819 0.3858 E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1 4.300 4.400 4.500 0.1693 0.1732 0.1772 e - 0.650 - - 0.0256 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - ST33TPHF2ESPI Package information DB2716 - Rev 4 page 9/26 |
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