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ST33TPHF2ESPI Datenblatt(PDF) 13 Page - STMicroelectronics

Teilenummer ST33TPHF2ESPI
Bauteilbeschribung  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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ST33TPHF2ESPI Datenblatt(HTML) 13 Page - STMicroelectronics

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5.3
Thermal characteristics of packages
The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages.
Table 4. Thermal characteristics
Parameter
Symbol
Value
Recommended operating temperature range
Ambient temperature
TA
−40 to 105 °C
Case temperature
TC
-
Junction temperature
TJ
−43 to 108 °C
Absolute maximum junction temperature
-
125 °C
Maximum power dissipation
-
63 mW
Theta-JA, -JB and -JC
Junction to ambient thermal resistance
θJA
35.8 at 0 lfpm (1)
Junction to case thermal resistance
θJC
1.48 at 0 lfpm(1)
Junction to board thermal resistance
θJB
13.9 at 0 lfpm(1)
1. Linear feet per minute.
ST33TPHF2ESPI
Thermal characteristics of packages
DB2716 - Rev 4
page 13/26



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