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ST33TPHF2ESPI Datenblatt(PDF) 16 Page - STMicroelectronics

Teilenummer ST33TPHF2ESPI
Bauteilbeschribung  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Datenblatt(HTML) 16 Page - STMicroelectronics

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Figure 12. Embossed carrier tape for TSSOP28 4.4 mm body width
W
T
K
Bo
D
P2
Po
B1
Ao
Bo
P
F
E
D1
User direction of feed
Ko
Top
Cover
Tape
1.
Drawing is not to scale.
Figure 13. Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width
Typical
User direction of feed
Table 8. Carrier tape constant dimensions for TSSOP 4.4 mm body width
Tape size
Ao, Bo, Ko (1)
D
E
Po
T Max.
Unit
16 mm
See note.
1.5 +0.1 / −0
1.75 ±0.1
4 ±0.1
0.4
mm
1. Ao, Bo, Ko, are determined by components sizes. The clearance between the component and the cavity
must be within 0.05 mm (Min.) to 0.90 mm (Max.)
ST33TPHF2ESPI
Delivery packing
DB2716 - Rev 4
page 16/26



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