Data Sheet

ADRF5547

Rev. A | Page 15 of 15

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

1.00

0.95

0.85

0.45

0.40

0.35

0.20 MIN

4.70

4.60 SQ

4.50

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-5

40

1

11

10

20

21

30

31

SIDE VIEW

EXPOSED

PAD

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDICATOR

AREA

DETAIL A

(JEDEC 95)

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

Figure 29. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.95 mm Package Height

(CP-40-15)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADRF5547BCPZN

−40°C to +105°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-15

ADRF5547BCPZN-R7

−40°C to +105°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-15

ADRF5547BCPZN-RL

−40°C to +105°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-15

ADRF5547-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D20790-6/20(A)