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MCP39F511N Datenblatt(PDF) 54 Page - Microchip Technology |
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MCP39F511N Datenblatt(HTML) 54 Page - Microchip Technology |
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54 / 61 page ![]() 2015-2018 Microchip Technology Inc. DS20005473B-page 54 MCP39F511N Microchip Technology Drawing C04-140C Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN] Dimension Limits Units D Overall Width Overall Length Exposed Pad Length Exposed Pad Width Contact Thickness D2 E2 E 3.35 MILLIMETERS 0.20 REF MIN A3 MAX 5.00 BSC 3.25 Contact Length Contact Width L b 0.45 0.30 Notes: 1. K Contact-to-Exposed Pad 0.20 NOM BSC: Basic Dimension. Theoretically exact value shown without tolerances. 3. 2. REF: Reference Dimension, usually without tolerance, for information purposes only. Standoff A1 0.02 Overall Height A 0.90 Pitch e 0.50 BSC Number of Pins N28 0.35 0.18 3.15 3.15 0.00 0.80 0.25 0.40 - 3.25 5.00 BSC 3.35 0.05 1.00 - Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M. Package is saw singulated. |
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